Technical Sales & Applications Program (TSAP)
NXP Semiconductors
About the Role
The Technical Sales & Applications Program (TSAP) is NXP’s early-career development program for new college graduates pursuing customer-facing technical roles within NXP’s Global Sales organization, with a focus on driving success in the Industrial, IoT, and Automotive markets. TSAP prepares participants for a long-term career as Field Application Engineers (FAEs) through a combination of structured learning and on-the-job experience. Upon completion, participants transition into a permanent FAE role within the Americas Sales organization. The FAE role provides customers with technical guidance on NXP solutions and hands-on technical support.
Program Structure (9–12 Months)
- Integrated Learning & On-the-Job Development
- Structured Learning: Semiconductor and system fundamentals; NXP product portfolios; embedded systems and software fundamentals; business fundamentals; instructor-led training.
- On-the-Job Training: Working with experienced field application engineers, technical sales engineers (TSEs), technical product teams, NXP partners, and customers to solve technical problems, support design-in activity, and build deep applications knowledge.
Key Responsibilities
- Provide technical leadership to sales teams and customers covering NXP portfolio.
- Lead proof of concept development, product evaluations, debug activities, integration efforts, lab validation, and basic system-level troubleshooting using tools such as oscilloscopes, current/voltage probes, power analyzers, and software debug/trace tools.
- Provide design support through schematic and PCB reviews.
- Prepare and deliver technical presentations, demonstrations, and training materials.
- Collaborate with sales, marketing, product management, and engineering teams to communicate customer needs and support business opportunities.
- Drive enablement initiatives by communicating customer feedback, identifying gaps in collateral, and partnering with product lines to improve tools, software, and documentation.
- Represent NXP technology at customer meetings, workshops, partner, and industry activities.
Requirements & Tech Stack
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field.
- Graduate in past 24 months or upcoming graduate.
- Minimum GPA of 3.0 or higher.
- Passion for electronics and embedded MCU/MPU software for robotics applications, including real-time control, motor control, sensor integration, edge AI, and Linux- or RTOS-based system development.
- Foundational understanding of analog and digital circuits, embedded systems, microcontrollers, processors, semiconductor applications, and software development skills in C, C++, Python, or similar languages.
- Familiarity with embedded debugging and development environments, including IDEs, SDKs, evaluation boards, and common lab tools.
- Strong problem-solving and analytical skills.
- Ability to learn new technologies quickly.
- Good written and verbal communication skills.
- Ability to work effectively in a collaborative, cross-functional, and customer-focused environment.
- Self-motivated, curious, and eager to develop both technical expertise and business acumen.
- Experience presenting technical work through class projects, internships, research, competitions, or student organizations.
- Demonstrated leadership, teamwork, or campus involvement.
- Internship, co-op, or project experience in applications engineering, design engineering, embedded software, technical sales, or customer support.
- Willingness to relocate to Austin and travel primarily within North America.
Bonus Skills (Nice to Have)
- Familiarity with ARM-based embedded systems, RTOS basics, or Linux embedded development.
- Exposure to embedded software development or debugging through academic or hands-on projects.
- Exposure to robotics software, motion control, or sensor integration concepts.
- Familiarity with common embedded communication interfaces such as UART, SPI, I2C, CAN, USB, or Ethernet.
- Exposure to basic real-time control or motor-control concepts.
- Exposure to sensing, perception, or sensor-fusion concepts for robotics or edge systems.
- Familiarity with edge AI or embedded ML.
- Awareness of embedded security, safety, and reliability concepts.