Module Engineering PhD Intern New 2027

Intel

Hillsboro, ORFresher1h agovia LinkedInH-1B sponsor · 8 entry-level filings

Module Engineering PhD Intern

About the Role

Intel Foundry Logic Technology Development (LTD) is seeking a Graduate intern to conduct scientific research enabling manufacturing of innovative device architectures. The intern will design, execute, and analyze experiments to meet engineering specifications for their process, and participate in process and equipment development. This role contributes to module process development, process integration flows, and equipment configuration for manufacturing modules, with potential support for yield improvement initiatives.

Key Responsibilities

  • Contribute to process development, continuous improvement, and implementation of semiconductor manufacturing processes for a specific module within LTD Metals.
  • Design, execute, and analyze experiments, presenting conclusions and recommendations.
  • Collaborate with fab technicians and support experiment execution with clear instructions.
  • Assist engineering teams in process flow troubleshooting and metrology optimization strategies.
  • Apply statistical analysis and design of experiments to enhance process reliability and throughput.
  • Gain experience in materials and device characterization techniques, such as ellipsometry, xray-based techniques, 4-point probe, AFM, SEM, and TEM.

Requirements & Tech Stack

  • PhD student in Chemical Engineering, Electrical Engineering, Material Science, Physics, Chemistry, Mechanical Engineering, or a related field of study.
  • Knowledge of semiconductor processing fundamentals, including thin films deposition, lithography, etching, polishing.
  • Experience in thin films materials deposition techniques (ALD, CVD, PVD or electroplating) and characterization (ellipsometry, XRF, XPS, XRR, 4-point probe, AFM, SEM, TEM, etc.).
  • Hands-on lab/fab equipment experience.
  • Data analysis skills with demonstrated ability to construct clear data-based problem statements and design of experiments.

Qualifications

  • PhD student in Chemical Engineering, Electrical Engineering, Material Science, Physics, Chemistry, Mechanical Engineering, or a related field of study.
  • Knowledge of semiconductor processing fundamentals.
  • Experience in thin films materials deposition techniques and characterization.
  • Data analysis skills.
  • Preferred: PhD student 3rd or 4th year; experience with thin film deposition and characterization.

Work Model

  • This role requires an on-site presence.

H-1B sponsor

Intel filed 8 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

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