Field Applications Program, Digital

Texas Instruments

Waltham, MAFresher1h agovia LinkedInH-1B sponsor · 18 entry-level filings

Field Applications Program - Digital

About the Role

This 12-month Field Applications Engineer track aims to establish rising Field Applications Engineers (FAEs) as technical experts with customer engineers and internal teams. The track includes 3 rotations:

  • Rotation 1, Field Sales Office (FSO):
  • Learn to work directly with customers to solve technical challenges.
  • Maximize TI's revenue by providing customers with system-level solutions.
  • Analyze technical trade-offs.
  • Understand component selection.
  • Solve design and cost challenges.
  • Rotation 2, Mass Market (MM):
  • Train FAEs on how to scale actions across multiple customers within a given sector or EE.
  • Participate in innovative projects to create new and efficient sales processes.
  • Leverage TI’s resources and automation.
  • Practice scalable selling techniques.
  • Decision making in imperfect circumstances.
  • Direct customer interactions.
  • Rotation 3, Business Unit/Systems Engineering & Marketing (BU/SEM):
  • Gain hands-on experience understanding how TI components fit together for system-level solutions.
  • Train on business acumen, technical capabilities, and processes for new product definition and introduction.
  • Technical product selection.
  • Schematic/layout capture.
  • PCB layouts.
  • Fabrication processes.
  • Board bring up and validation.

Upon successful completion of the track, participants become FAEs on TI's Worldwide Sales & Applications team.

Key Responsibilities

As a Field Applications Engineer, your responsibilities include:

  • Using various sales tools and relationships with design engineering to identify potential projects.
  • Providing customers with proactive proposals for complete, system-level solutions that maximize TI content.
  • Using broad technical expertise to influence customers' part selection process while favorably positioning TI versus competition.

Requirements & Tech Stack

  • Bachelors degree in Electrical Engineering, Electronics Technology, Electrical Engineering Technology, Electrical and Computer Engineering or related field.
  • Cumulative 3.0/4.0 GPA or higher.
  • Experience with lab equipment such as oscilloscopes.
  • Soldering and debugging skills.
  • Programming skills in C/C++ (LabView recommended).
  • Demonstrated strong analytical and problem solving skills.
  • Excellent communication and presentation skills.
  • Ability to work in teams and collaborate effectively.
  • Strong time management skills.
  • Ability to build lasting, influential relationships.
  • Ability to work effectively in a fast-paced and ever-changing environment.
  • Ability to take initiative and drive for results.
  • Ability to influence decisions through a sense of urgency and competitive drive.

Pay Range

$90,000 - $125,000

H-1B sponsor

Texas Instruments filed 18 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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