New College Grad

Micron Technology

Boise, IDFresher51m agovia LinkedInH-1B sponsor · 48 entry-level filings

About the Role

The High Bandwidth Memory (HBM) Heterogeneous Integration Group (HIG) develops advanced memory solutions for Machine Learning (ML), Artificial Intelligence (AI), and high-performance computing. As a Design Validation Product Engineer, you will be crucial in the development and validation of next-generation HBM products. This role offers the opportunity to work with semiconductor design, silicon validation, hardware and software debugging, and data analysis, collaborating with global multi-functional teams.

Key Responsibilities

  • Develop expertise in JEDEC HBM specifications, internal architecture documentation, and HBM design schematics and layouts.
  • Perform silicon validation and characterization of HBM products using laboratory equipment, circuit simulations, debugging techniques, and data analysis.
  • Collaborate with Product Engineering, Design, Manufacturing, Test, Quality, and other multi-functional teams to identify and resolve technical issues.
  • Analyze validation data, identify trends, and implement solutions to improve product performance, quality, reliability, and manufacturability.
  • Apply AI-Assisted and AI-Enabled tools for data analysis and debugging to improve validation efficiency and accelerate root-cause analysis.

Requirements & Tech Stack

  • Experience with one or more of the following: schematic analysis, circuit simulation, data analysis, laboratory debugging, or pattern manipulation.
  • AI tools for engineering analysis, automation, debugging, or productivity improvements.
  • Python, C/C++ programming.
  • Verilog, VHDL, or SystemVerilog.
  • Knowledge of memory architectures, semiconductor validation methodologies, or high-speed interface technologies.

Qualifications

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field.
  • Demonstrated problem-solving and analytical skills through academic projects, internships, research, or professional experience.
  • Ability to manage multiple priorities and deliver high-quality work in a fast-paced environment.
  • Proven ability to collaborate and communicate effectively within a team-based engineering organization.
  • Demonstrated initiative, innovation, and strong written and verbal communication skills.
  • Passion for continuous learning and process improvement.

H-1B sponsor

Micron Technology filed 48 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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