Packaging Module Equipment Development Engineer

About the Role

This position is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, dedicated to advancing and scaling innovative semiconductor packaging solutions. The role is to develop and optimize semiconductor packaging processes and equipment for Intel's next-generation roadmap.

Key Responsibilities

• Process & Equipment Qualification: Develop, optimize, and qualify advanced packaging assembly processes, materials, and hardware configurations to meet yield, reliability, and cost requirements.
• Equipment Integration: Manage first-time process integration and equipment selection, with a focus on dispense, mold, and/or cure technologies.
• Reliability Simulation & Testing: Develop and maintain systems to evaluate silicon and packaging technologies under simulated field-use conditions.
• Statistical Process Control: Lead efforts to design experiments (DOE), apply statistical methods (SPC), and analyze manufacturing data to define process windows and continuously optimize productivity.
• Supplier & Vendor Management: Establish raw material and tooling specifications, and partner with contract assemblers, material vendors, procurement, and supplier quality teams.
• Data-Driven Problem Solving: Create new techniques, quality screens, and acceleration methods to ensure the early identification of quality and reliability risks based on failure mechanisms.
• Factory Standardization: Drive global standardization of product qualifications, manufacturing quality systems, equipment configurations, and process flows across multiple Intel manufacturing sites.
• Technical Documentation: Author detailed technical reports, process specifications, qualification logs, and technical white papers to support technology transfers.

Requirements & Tech Stack

• Structured Technical Leadership: Strong leadership skills to guide cross-functional teams and manage complex technical projects.
• Strong Strategic Influencing: Exceptional communication and interpersonal skills.
• Analytical Problem Solving: Deep analytical mindset for diagnosing complex hardware and process-related challenges.
• Action-Oriented Decision Making: Driven self-starter focused on achieving results.

Qualifications

Minimum Qualifications:

An applicant must meet one of the following educational and experience criteria:

• A Bachelor’s degree in Mechanical, Electrical, Material Science or Chemical Engineering, or a related STEM field with 4+ years of relevant semiconductor industry experience.
• OR a Master’s degree in a matching STEM discipline with 3+ years of relevant semiconductor industry experience.
• OR a PhD in a matching STEM discipline with 6+ months of relevant semiconductor industry experience.

Required Experience Parameters:

• Utilizing Statistical Process Control (SPC) or Design of Experiments (DOE) principles within a high-tech manufacturing environment.
• Managing technical change control, equipment sustaining, or quality data systems.
• Structured problem solving, development of sound hypothesis and data-driven validation plans.

Preferred Qualifications:

• 2+ years of experience:
• Hands-on semiconductor packaging process development or equipment engineering experience.
• Managing first-time process integration, tooling selection, or equipment qualifications—specifically with dispense, mold, or cure hardware.
• Managing complex, time-critical technical projects from development through manufacturing transfer.

Work Model

This role will require an on-site presence.