Engineer, Node Development PE

Micron Technology

Boise, IDFresher2d agovia LinkedInH-1B sponsor · 48 entry-level filings

About the Role

  • Product Engineer in the Node Development group at Micron Technology.
  • Focus on developing industry-leading DRAM.
  • Engage on new technology at design start.
  • Responsible for delivering technology to enable the full product portfolio, initial device qualification, and production ramp.
  • Accomplished through innovation and cross-functional engagement with partner groups (Design, Test, Technology Development, Marketing, Manufacturing, and Quality Assurance).
  • Motivated to grow in technical breadth and depth, learning while being a valued member of a team.

Key Responsibilities

  • Enable new process node startup, qualification, yield, and ramp.
  • Collaborate with internal engineering groups (Design, Technology Development, Design for Test, and Quality teams) to understand yield issues and priorities.
  • Provide direction to development teams using thorough knowledge for process integration.
  • Develop key metrics for feedback on new technology.
  • Support design verification and validation using CAD tools and simulations.
  • Perform electrical failure analysis and yield improvement using both data and bench testing analysis.
  • Identify design marginalities and recommend design solutions for circuit-related problems.
  • Utilize state-of-the-art in-house engineering equipment to support product characterization and electrical failure analysis.
  • Identify causes of low yield through systematic analysis.
  • Utilize statistical tools for detailed data analysis on product to drive yield improvement projects.

Requirements & Tech Stack

  • Bachelor's degree in electrical or computer engineering or equivalent.
  • Effective written and spoken communication skills.
  • Intermediate to advanced Agentic AI usage and understanding of Large Language Models including Claude, Copilot, etc.
  • Good organizational skills.
  • Able to make decisions in complex situations.
  • Excellent problem-solving and analytical skills.
  • Strong presentation skills.

Qualifications

  • Exposure to semiconductor memory (DRAM, SRAM, NAND) through coursework, projects, or internships.
  • Familiarity with simulation or CAD tools from academic experience.
  • Basic knowledge of statistics, data visualization, or scripting for analysis.
  • Internship, co-op, or research experience in hardware, validation, or test engineering.
  • Self-motivation and enthusiasm.

H-1B sponsor

Micron Technology filed 48 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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