Process Integration Engineer

Micron Technology

Boise, IDFresher51m agovia LinkedInH-1B sponsor · 48 entry-level filings

About the Role

This entry-level role offers hands-on experience in yield improvement, cost reduction, and technology transfer for next-generation devices. You will work in a fast-paced environment, collaborating with cross-functional teams to ensure best-in-class quality and performance.

Key Responsibilities

  • Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments.
  • Drive improvements in yield, cost efficiency, and quality.
  • Run Design of Experiments (DOE) to enhance process capability and margin.
  • Monitor trends and sustain line stability.
  • Address top detractors to improve device yield and reliability.
  • Lead workshops during technology transfer for next-generation devices.
  • Start up, develop, and optimize processes for product quality and reliability.
  • Identify and resolve process-related issues using FMEA, 8D, SPC/FDC methodologies.
  • Coordinate and execute process, equipment, and material evaluations.
  • Validate and qualify new processes, tools, and materials for new product introduction.
  • Manage and audit material suppliers to meet quality, cost, and risk objectives.
  • Support internal and external audits.
  • Be willing to travel internationally for 3+ months for tech transfer/training.
  • Be prepared to work a shifted schedule as required.
  • Good understanding of Agentic AI or willingness to learn Agentic AI to help developed efficient workflow.

Requirements & Tech Stack

  • Bachelor’s degree in Materials Science, Electrical, Electronics, Chemical, or related engineering fields.
  • Basic understanding of MOSFET and DRAM operation.
  • Knowledge of CMOS and characterization methods.
  • Familiarity with DOE, SPC, and JMP.
  • Ability to support SPC/FDC/RMS/APC systems and site-to-site portability.

Preferred Qualifications

  • Master’s or Ph.D. degree in a relevant field.
  • Internship experience in a 300mm semiconductor environment.
  • Exposure (academic or internship) to:
  • Semiconductor and memory technologies.
  • Transistors and metallization processes.
  • Yield ramp and fabrication processes.

H-1B sponsor

Micron Technology filed 48 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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