Equipment Engineer-Thin Film-CVD

About the Role

TSMC Washington is seeking a Junior Equipment Engineer to join our Thin Film Equipment (TFE) team, specializing in Chemical Vapor Deposition (CVD) equipment. This role focuses on maintaining tool availability, optimizing maintenance procedures, reducing downtime, and sustaining high-yield semiconductor manufacturing in a 24/7 cleanroom environment. The position offers extensive hands-on training and mentorship.

Key Responsibilities

• Equipment Maintenance & Sustaining:
• Perform preventive maintenance (PM), calibration, and troubleshooting on CVD tools (e.g., HDP, PECVD, SACVD from Applied Materials, Lam Research).
• Respond to tool alarms and line-down events to restore production and minimize repair time.
• Performance & Quality Control:
• Monitor tool health, particle performance, thickness uniformity, and SPC charts.
• Collaborate with CVD Process Engineers to qualify equipment modifications, new parts, and recipe implementations.
• Continuous Improvement:
• Support root cause analysis (RCA) for tool issues and component failures.
• Assist senior engineers with equipment upgrade projects, spare parts management, and maintenance cost reduction.
• Documentation & Safety Compliance:
• Author, review, and standardize Standard Operating Procedures (SOPs) and maintenance checklists.
• Adhere to cleanroom protocols, EHS guidelines, and hazardous chemical/gas handling procedures.
• Operational Coverage:
• Work in the cleanroom wearing PPE.
• Participate in shift handover routines and support on-call or rotation schedules as required by 24/7 fab operations.

Requirements & Tech Stack

• Education: Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering, Mechatronics, Physics, or a related STEM field.
• Technical Skills:
• Basic understanding of vacuum systems, RF power delivery, gas delivery/MFCs, thermal controls, robotics, or pneumatic systems.
• Familiarity with data analysis tools (e.g., Excel, SPC) and basic statistical concepts.
• Soft Skills:
• Strong problem-solving mindset.
• Willingness to work hands-on with hardware inside a cleanroom.
• Solid written and verbal communication skills.
• Ability to document complex mechanical procedures clearly.
• Strong team player capable of coordinating effectively across operations, process engineering, and vendor support teams.

Qualifications

• Minimum Qualifications:
• 0–2 years of experience in equipment maintenance, cleanroom manufacturing, electromechanical troubleshooting, or relevant academic lab/internship projects.
• Preferred Qualifications:
• Previous internship or co-op experience within a semiconductor wafer fabrication plant or flat-panel display facility.
• Hands-on familiarity with Applied Materials (AMAT Producer/Centura) or Lam Research (SEQUEL/SPEED) deposition platforms.
• Basic understanding of CVD film deposition mechanisms, precursors, and plasma physics.
• Additional Soft Skills:
• Fast learner with a strong desire to develop technical expertise.
• Excellent team player with strong communication skills.
• Demonstrated tenacity, adaptability, and flexibility in a fast-paced environment.
• Strong attention to detail and a hands-on approach to problem-solving.
• Strong teamwork and cross-functional communication skills.

Eligibility & Work Conditions

• Must possess legal authorization to work in the United States. (No sponsorship provided.)
• Must successfully pass a background check and a drug screening (cannabis will not be tested for in compliance with Washington state regulations).
• Work Location: On-site at Camas, Washington.
• Schedule: Monday through Friday, 8 am – 5 pm, with potential for additional hours.