Integration Engineer
Analog Devices
About the Role
The Process Integration Team is seeking an Integration Engineer to join a collaborative and highly technical group of 10-12 engineers. This team partners closely with process module engineering organizations to identify, troubleshoot, and resolve manufacturing and quality challenges across the semiconductor fabrication process. Team members gain broad exposure to silicon-based semiconductor products, supporting all stages of production from starting silicon through wafer fabrication, assembly, and final packaged die. The role offers a unique opportunity to develop a comprehensive understanding of semiconductor manufacturing while driving yield, quality, and process improvements.
Key Responsibilities
- Interpreting and responding to electrical signals from Si-based semiconductor devices and establishing connections to process conditions.
- Leading teams of process module engineers to resolve yield and parametric problems.
- Optimization of semiconductor manufacturing processes to improve productivity and/or quality.
- Interpretation of SEM, TEM, and EDX analysis to establish root cause of electrical signals in semiconductor devices.
- Transfer of Si semiconductor processes between manufacturing facilities and to larger wafer diameter in the same facility.
- Teamwork with Product and Defect engineering to identify yield limiters for yield improvement.
Requirements & Tech Stack
- BS or MS in Electrical Engineering or associated engineering field with semiconductor device background.
- 0-3 years of experience working in a cleanroom environment.
- Understanding of CMOS and Bipolar Junction Transistor (BJT) structures and device operation.
- Knowledge of how process variables influence electrical characteristics of CMOS and BJT devices.
- Ability to work in a team environment with strong written and verbal communication skills.
- Basic understanding of operation of common semiconductor process operations:
- Photolithography
- Plasma etch
- Plasma Enhanced Chemical Vapor Deposition (PECVD)
- Epitaxial growth
- Furnace oxidation
- Low Pressure Chemical Vapor Deposition (LPCVD)
- Implant
- Chemical Mechanical Polish (CMP)
- Wet chemical etch
- Physical Vapor Deposition (PVD)
- Rapid Thermal Anneal (RTA)
Qualifications
- Knowledge of Statistical Process Control (SPC) (Preferred).