2027 Undergrad Thermal Engineering Intern/Co-Op

About the Role

AMD is seeking highly motivated Thermal Engineering interns/co-ops to support the development of advanced cooling technologies for AI, high-performance computing, and data center platforms. As an intern or co-op, you will work alongside experts and industry pioneers, contributing to projects that impact millions of end-users worldwide.

Job Details

• Location: Austin, TX or Secaucus, NJ
• Onsite: Full-time (40 hours a week) onsite work required.
• Duration: Varies based on program term (Spring/Summer Co-op, Summer Internship, Summer/Fall Co-op).

Key Responsibilities

• Involvement in the thermal and hydraulic characterization of cooling solutions including cold plates, manifolds, heat exchangers, coolant loops, and rack-level cooling systems.
• Evaluation of air-cooled and liquid-cooled platforms through thermal, airflow, coolant-flow, and pressure-drop analysis.
• Support in laboratory testing, instrumentation setup, sensor deployment, data acquisition, and thermal validation.
• Development of scripts and tools to automate test execution, data processing, engineering analysis, and reporting.
• Projects involving thermal modeling, simulation, and comparison of measured data against design expectations.
• Investigation of thermal, flow, and power-related issues and collaboration with engineering teams for solutions.
• Documentation of technical findings and communication of results through engineering reports, presentations, and technical documentation.

Requirements & Tech Stack

• Currently enrolled in a U.S.-based university pursuing a Bachelor's or Master's degree in Mechanical Engineering, Aerospace Engineering, Thermal Sciences, or a related engineering discipline.
• Knowledge or experience with the following technical skills (or related areas):
• Heat transfer, thermodynamics, fluid mechanics, thermal-fluid systems, or engineering analysis.
• Thermal management solutions, liquid cooling technologies, electronics cooling concepts, cold plates, heat exchangers, thermal interface materials, airflow management, or coolant flow systems.
• Laboratory testing, instrumentation, sensors, thermal characterization, data acquisition systems, or experimental validation methodologies.
• CAD software such as SolidWorks or Creo.
• CFD software, thermal simulation tools, or engineering analysis software including ANSYS Icepak, Fluent, FloTHERM, COMSOL, OpenFOAM, or similar tools.
• Strong analytical, problem-solving, communication, and technical documentation skills.
• Exposure to AI infrastructure, high-performance computing systems, server technologies, data center platforms, or energy-efficient cooling technologies is a plus.
• This role is not eligible for visa sponsorship.