Module Development Engineer, LTD Dry Etch

About the Role

Join Intel Logic Technology Development and advance the next generation of patterning. You will operate in a high impact space, partnering closely with cross-functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long-term systems that sustain performance. This role requires regular onsite presence to fulfill essential job responsibilities.

Key Responsibilities

• Drive technology development for future technology and high-volume manufacturing, provide process integration and equipment solutions, and perform feasibility studies to meet desired device specifications.
• Own and drive development of the next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies.
• Perform pathfinding activities in support of process and hardware development on existing and first-of-kind equipment, enabling manufacturing of innovative device architectures and developing roadmaps for technologies enabling future roadmap.
• Provide technical leadership for cross-functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions.
• Design and execute comprehensive characterization plans; plan and conduct experiments (DOE / response surface / robustness studies) across the development cycle.
• Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems).
• Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture).
• Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment.
• Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders.
• Recommend and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
• Partner with key equipment and material suppliers to develop and implement enabling elements of the technology.
• Perform process technology feasibility studies through theoretical simulations and/or practical engineering methods.

Core Competencies

• Strong collaboration and problem-solving skills to work effectively in cross-disciplinary teams.
• Ability to communicate technical data and concepts to both technical and non-technical audiences.

Requirements & Tech Stack

• Hands-on experience in dry etch semiconductor manufacturing, including ownership of process development and optimization.
• Experience with plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms.
• Experience delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability.
• Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data-based decisions.
• Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation.
• Expertise in APC development and variability reduction in a manufacturing environment.
• Expertise in etch driven defect reduction and metrology in a manufacturing environment.
• Proven ability to lead technical problem solving across projects, influencing peers and stakeholders without formal people management responsibility.

Qualifications

• PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor-related STEM field with relevant industry or graduate school research experience.
• OR -
• Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor-related STEM field with 2 years of relevant industry or graduate school research experience.
• OR -
• Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor-related STEM field with 4+ years of industry experience at a leading foundry or dry etch equipment supplier.

Preferred Qualifications (Additional)

• 4+ years of direct industry experience developing and deploying dry etch processes for advanced logic, foundry technologies or dry etch equipment suppliers.
• Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High Aspect Ratio Etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration.