Manufacturing Engineering I

Raytheon

Andover, MA0–2 yrs38m agovia LinkedIn

About the Role

Raytheon is seeking a Manufacturing Engineering I (3rd Shift) to support the Circuit Card Assembly Factory in Andover, MA. This is an onsite position.

Key Responsibilities

  • Support the operation of Conformal Coating Process lines, including automated and programmable equipment for multiple products and coating types.
  • Drive process improvement, cycle time reduction, defect prevention, and operator support.
  • Participate in process improvement initiatives, establishment of process baseline metrics, SPC implementation, defect prevention, and process data analysis.
  • Create and oversee projects using risk management techniques.
  • Translate engineering design requirements into formal manufacturing process documentation.
  • Perform computer and machine programming for manufacturing automation.
  • Disposition discrepant production hardware.
  • Lead root cause and corrective action investigations to solve problems and prevent recurrence.
  • Participate in process improvement and cost reduction initiatives using Lean Manufacturing methodology.
  • Conduct manufacturing process development and support.
  • Perform safety, job hazard, and/or ergonomic assessments.
  • Interact with senior personnel on technical matters, requiring coordination between organizations and/or suppliers.
  • Develop tools/fixtures to drive ergonomics and reductions in cost and/or defects.

This is a third shift position which includes a 12% added pay differential.

Requirements & Tech Stack

  • Active and transferable U.S. government issued security clearance is required prior to start date.
  • U.S. citizenship is required.
  • DoD Clearance: Confidential
  • Ability to obtain INTERIM U.S. government issued security clearance is required prior to start date.

Qualifications

  • Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and less than 2 years prior relevant experience.
  • Knowledge and experience with ANSI J-STD-001 Class 3 & IPC-CC-830 (or MIL-I-46058).
  • Experience with supporting circuit card assembly production floor (process and/or quality focus).
  • Experience with Specialized Tooling Development (Jigs, Fixtures, Specialized Packaging Development).
  • Experience with Masking Development (Boots, Die Cuts, automated masking dispensing).
  • Experience/Knowledge of IPC-CC-830 Coatings – Urethane, Silicone, Parylene, Acrylic, and Epoxy.

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