Micro-electronics Technician

About the Role

Anduril Industries is a defense technology company transforming military capabilities with advanced technology. The Advanced Infrared Solutions (AIRS) team, part of the Imaging Business Line, designs and builds high-performance cooled infrared cameras and subsystems. AIRS is expanding its merchant supplier business alongside internal production.

Key Responsibilities

• Execute Complex Wire Bonding Operations: Operate and maintain manual, semi-automatic, and automated bonders (e.g., Westbond) for precise gold ball, wedge, ribbon, alloy, and manganin wire bonding (e.g., 0.001" diameter) onto substrates like duroid and ceramic, capacitors, resistors, diodes, and spirals.
• Perform Microelectronic Assembly: Conduct intricate assembly tasks including mixing and applying adhesives, glues, and epoxies, and integrating micro-electronic components like temperature diodes, capacitors, and alumina materials.
• Interpret Technical Documentation: Read and interpret detailed build sheets, Interface Control Documents (ICDs), and engineering drawings, adhering to complex specifications and process requirements.
• Equipment Setup and Optimization: Independently perform setup, calibration, and minor adjustments to wire bonding machinery to optimize parameters like loop heights for bond quality and throughput.
• Quality Assurance and Inspection: Conduct in-process and final inspections using measurement equipment (e.g., reticle, indicator, microscope, bond puller) to verify bond quality and ensure compliance with design specifications.
• Troubleshooting and Collaboration: Identify, analyze, and resolve technical problems with technicians and engineers, contributing to process improvements and parameter optimization.
• Maintain Production Standards: Meet high standards for quality and consistency while adhering to all cleanroom protocols, safety guidelines, and ESD procedures.

Requirements & Tech Stack

• High School Diploma or equivalent.
• Hands-on experience in wire bonding or microelectronic manufacturing, OR equivalent practical skills from a technical bootcamp or certification program.
• Proven proficiency in wire bonding techniques (manual gold ball, wedge, ribbon; semi-automatic; automated) and intricate microelectronic assembly, including precise adhesive and epoxy application.
• Exceptional manual dexterity and ability to work consistently and accurately under a microscope for an entire shift.
• Strong ability to read, interpret, and follow detailed technical documentation (build sheets, ICDs, engineering drawings).
• Commitment to maintaining a clean, safe, and ESD-compliant work environment.
• Must be a U.S. Person.

Salary Information

• US Hourly Range: $35 — $50 USD