Ocotillo Failure Analysis Technician

Key Responsibilities

• Prepare TEM samples using Dual Beam FIB/PFIB and related techniques for site-specific analysis.
• Operate lab tools including SEM, FIB/PFIB, and optical imaging systems for material analysis and sample prep.
• Perform wafer handling, coating, and pre-treatment processes to support TEM workflows.
• Execute sample fabrication steps based on schematics, layouts, and engineering instructions.
• Partner with engineers and analysts to ensure samples meet quality and turnaround expectations.
• Support lab sustaining activities including safety, tool maintenance, and process documentation.
• Participate in process improvements, BKM development, and cross-training on new techniques.
• Maintain accurate documentation and follow standard operating procedures.
• Operate lab instruments to support high volume manufacturing of advanced technology nodes.
• Hands-on handling of Silicon Wafer/pieces.
• Operate lab tools such as sputter coaters and spin coaters for sample pre-treatment.
• Operate Dual Beam FIB/PFIB for site-specific cross-sectioning and TEM sample preparation, including site marking, depositing protective materials, de-layering, imaging, and TEM lamella preparation.
• Operate SEM for imaging and material analysis.
• Perform moderately complex sample fabrication procedures based on schematics, diagrams, written and verbal descriptions, layouts, or plans.
• Participate in safety forums, lab sustaining and development, process transfer, tool ownership, BKM development, and cross-training on other techniques.
• Willing to work a compressed shift with a 12-hour schedule.
• Ability to lift and carry up to 50 lb.
• Long periods of standing and occasional walking.

Requirements & Tech Stack

• SEM
• FIB/PFIB
• Dual Beam FIB/PFIB
• TEM
• Sputter Coaters
• Spin Coaters
• Silicon Wafer Handling
• Electron Microscopy
• Mechanical Polishing
• Tracking and reporting systems for failure analysis cases.

Qualifications

• High School diploma with 1+ years of hands-on experience in failure analysis, product testing, or a related domain.
• OR an AA/AS degree with no prior professional experience.
• Demonstrated expertise in utilizing analysis tools such as electron microscopy, mechanical polishing, or similar techniques through coursework, academic projects, internships, or hands-on training.
• Basic mechanical aptitude and ability to follow detailed procedures.
• US citizenship required.
• Ability to obtain and maintain a US Government Security Clearance.

Preferred Qualifications

• Strong communication and collaboration skills.
• Passion for innovation, problem-solving, and contributing to process improvements.
• Ability to learn and adapt quickly to new methodologies and tools in the field of failure analysis.
• Associate's degree or technical certification in a related field.
• Exposure to:
• SEM, FIB, or materials characterization tools.
• Semiconductor processing or cleanroom environments.
• Experience working in a lab, manufacturing, or technical environment.
• Active US Government Security Clearance, with a minimum of Secret level.

Behavioral Traits

• Strong attention to detail and procedural discipline.
• Ability to work in a fast-paced, high-volume lab environment with changing priorities.
• Good communication skills and ability to work across shifts and teams.
• Demonstrated ability to work independently and collaboratively.