DRAM Design Engineer

Micron Technology

Boise, IDFresher1h agovia LinkedInH-1B sponsor · 48 entry-level filings

About the Role

Micron Technology's DRAM Design Engineering Group (DDEG) is a global organization dedicated to advancing memory and storage innovation. The team collaborates across fields to solve complex semiconductor challenges and deliver world-class memory solutions through creativity, continuous learning, and engineering excellence.

Key Responsibilities

  • Design, analyze, and optimize digital, analog, memory, and logic circuits, including schematic development, layout, and verification.
  • Perform semiconductor design engineering activities such as chip layout design, circuit checking, parasitic modeling, and documentation of specifications.
  • Support design validation, reticle experiments, tape-out revisions, and evaluation of semiconductor devices and components.
  • Lead layout efforts including floorplanning, placement, and routing, and modify designs based on product requirements and logic diagrams.
  • Collaborate with Product Engineering, Test, Probe, Process Integration, Assembly, Marketing, and verification teams to ensure manufacturable and high-quality designs.
  • Leverage AI Assisted tools to enhance design analysis and debug efficiency.

Requirements & Tech Stack

  • Bachelor’s or Master’s degree in Electrical Engineering.
  • Experience in developing and evaluating digital and analog circuits for memory products.
  • Ability to model and simulate integrated circuits using SPICE and Verilog.
  • Working knowledge of Synopsys tools and Cadence Virtuoso.
  • Experience reviewing product specifications and logic flowcharts to define and implement semiconductor devices.
  • Experience working in AI-Enabled environments or willingness to leverage AI tools to support engineering productivity, automation, and data-driven workflows.

Qualifications

  • Experience in the design and development of volatile or nonvolatile memory technologies.
  • Knowledge of advanced memory technologies such as ferroelectric memory, wafer bonding, and advanced packaging.
  • Familiarity with small-signal sensing techniques.
  • Understanding of high-voltage reliability considerations in semiconductor devices.
  • Exposure to applying AI or AI Assisted techniques, including data-driven automation, to improve design or verification efficiency.

H-1B sponsor

Micron Technology filed 48 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

Entry-Level Mechanical Engineer Jobs · last 7 days

150 openings · 144 need no experience

Most hiring: Hired, Lockheed Martin, Newport News Shipbuilding, A Division of HII

See all 150 →

FirstHire never charges to apply, and real employers don't ask for money for tests, interviews or offer letters. How we list jobs · Report this job