Associate Quantum Hardware Assembly R&D Engineer

About the Role

IBM Quantum is seeking a motivated Associate Quantum Hardware Assembly R&D Engineer to join the Quantum Hardware team at the IBM Thomas J. Watson Research Center in Yorktown Heights, NY. This is an entry-level, fully on-site position.

Key Responsibilities

• Support the research, development, fabrication, and characterization of advanced electronic packaging technologies for quantum hardware.
• Develop and optimize assembly processes for next-generation quantum devices, including surface mount technology (SMT), die attach, flip-chip assembly, and related packaging techniques.
• Evaluate assembly yields, process capability, and package performance through electrical, mechanical, and physical characterization methods.
• Support hardware integration, process troubleshooting, and root-cause investigations to resolve assembly and packaging-related issues.
• Document experimental methods, results, and recommendations through technical reports, presentations, and formal documentation.
• Collaborate with multidisciplinary teams across IBM Quantum to support hardware development, integration, and technology maturation efforts.

Requirements & Tech Stack

• Ability to independently troubleshoot and solve complex technical problems.
• Ability to work effectively with interdisciplinary teams, including electrical engineers, fabrication engineers, materials scientists, and experimental physicists.
• Strong growth mindset with a desire to continuously learn and develop new skills.
• Strong attention to detail and commitment to high-quality work.

Qualifications

• Bachelor's degree in Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field.
• Prior experience with quantum hardware is not required.
• Academic, internship, or research experience involving materials development, characterization, or process engineering.

Bonus Qualifications:

• Hands-on experience with electronic packaging and assembly techniques, including die attach, flip-chip assembly, surface mount technology (SMT), soldering, or related processes.
• Experience with optical microscopy, SEM, cross-sectioning, metrology, and basic electrical testing.
• Familiarity with process development, statistical process control, yield analysis, or design-of-experiments (DOE) methodologies.