Engineer DRAM Product Development Engineer

Micron Technology

Boise, ID0–2 yrs1h agovia LinkedInH-1B sponsor · 48 entry-level filings

About the Role

As a Product Development Engineer in the DRAM Technology Node Development group at Micron, you will join a collaborative team building world-class memory technologies. You will work from initial development and silicon bring-up through certification, yield improvement, and production expansion. This opportunity lets you apply your academic background to practical semiconductor engineering skills while working with seasoned engineers on innovative projects.

Key Responsibilities

  • Support new DRAM process-node and product development, including build validation, silicon bring-up, qualification, yield learning, and production ramp.
  • Analyze electrical test, probe, simulation, and characterization data to determine trends, build marginalities, and potential causes of performance or yield loss.
  • Assist with characterization and optimization of memory, logic, and analog functions, such as Sense Amplifiers, timing distribution, calibration, training, and related control circuits.
  • Complete experiments and established debug methods; coordinate results, compare outcomes with expectations, and recommend data-supported next steps.
  • Collaborate with cross-functional partners to investigate process-, build-, test-, and manufacturing-related issues affecting product quality, robustness, performance, and manufacturability.
  • Use approved AI-enabled tools for engineering analysis, coding, automation, visualization, documentation, and problem-solving—while validating outputs and protecting confidential information.

Requirements & Tech Stack

  • Bachelor’s degree or master’s degree or equivalent experience in Electrical Engineering, Computer Engineering, Physics focusing on semiconductor electronics, or a related technical area.
  • Foundational understanding of semiconductor devices, CMOS circuits, digital or analog electronics, memory operation, computer architecture, build verification, test, or data analysis.
  • Demonstrated problem-solving ability through coursework, laboratory work, research, internships, co-ops, or technical projects.
  • Build proficiency with approved AI-assisted engineering tools and critically evaluate AI-supported results.
  • Ability to collect, coordinate, analyze, and communicate engineering data using tools such as Python, JMP, MATLAB, Excel, or similar software.

Qualifications

  • Coursework or project experience in semiconductor device physics, VLSI, CMOS building, analog or digital circuits, memory architecture, statistics, or the composition of experiments.
  • Exposure to DRAM or other memory technologies, circuit simulation, Verilog, CAD tools, bench characterization, semiconductor test, probe, or electrical failure analysis.
  • Experience developing scripts, dashboards, data pipelines, or automation that improves analysis quality or workflow efficiency.
  • Familiarity with structured problem-solving methods, statistical process control, development of experiments, or root-cause analysis.
  • Evidence of initiative, curiosity, collaborative behavior, and the ability to learn unfamiliar technical concepts.
  • Experience applying AI, machine learning, or generative AI to engineering workflows and decision support.

H-1B sponsor

Micron Technology filed 48 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

Entry-Level Jobs in the US · last 7 days

60 openings · 58 need no experience

Most hiring: Lockheed Martin, Ankura, Sevita

See all 60 →

FirstHire never charges to apply, and real employers don't ask for money for tests, interviews or offer letters. How we list jobs · Report this job