Associate FIB-SEM Engineer

About the Role

MITRE's Electronic Systems Security department is seeking talented and creative professionals with backgrounds in engineering and/or physical sciences and a focus on microelectronics processing. You will support advanced research and development projects of national significance, joining a team of technical experts in microelectronics security and collaborating with multi-disciplinary teams to advance the state-of-the-art in embedded security.

Key Responsibilities

• Participate in teams that perform hands-on security assessments of embedded systems.
• Develop new approaches and countermeasures for emerging physical threats to embedded systems.
• Delayer, cross-section, prepare TEM lamellae, and perform circuit edit on chips using state-of-the-art FIB and PFIB systems.
• Image chips with SEM and optical microscopy.
• Prepare samples for FIB-SEM, e.g. mechanical polishing and sputter coating with thin conductive materials.
• Target specific areas on chips with advanced navigation, per instructions from the microelectronics analysis team.
• Contribute to a safe laboratory working environment.
• Monitor tool performance and work with tool vendors for preventative maintenance and emergency repair.
• Contribute to process improvements, documentation, and cross-training.

Requirements & Tech Stack

• FIB-SEM and/or PFIB-SEM experience.
• Associated sample preparation experience.
• Effective oral and written communication skills.
• Ability to work independently and as part of a team.
• Attention to detail.
• Prolific at recording technical information in notebooks and internal reports.
• Must be eligible to obtain and maintain a Secret U.S Government issued Security Clearance.
• U.S. Citizen.
• On-site requirement: 5 days a week on-site.

Qualifications

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Physics, or equivalent combination of related education and work experience.

Preferred Qualifications

• Master’s degree or PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Physics, or a related field.
• Experience with semiconductor reverse engineering and/or failure analysis methods and equipment, such as:
• Wet chemistry
• Vacuum equipment
• Reactive ion etchers
• Micro/nanofabrication tools
• Failure analysis tools
• CAD navigation
• Precision milling and polishing stations
• Optical microscopy
• IR microscopy
• Mechanical tools
• Active security clearance.