Physical Design Automation Engineer

About the Role

The Design Technology Platform team at Intel Foundry India is chartered with process technology definition, advanced methodology development, and design prototyping on Intel's latest process nodes. We support Intel's internal and external design customers and offer a unique opportunity to be among the first engineers working on cutting-edge process technologies.

This is an individual contributor (IC) technical leadership role focused on physical design automation tools, flows, and methodologies on leading-edge process nodes.

Key Responsibilities

• Lead the development, deployment, and continuous improvement of RTL-to-GDS flows using Cadence Innovus as the primary PnR platform
• Define and drive physical design tools, flows, and methodologies including:
• Block-level implementation and integration
• Floorplanning, placement, CTS, and routing automation
• Timing closure methodologies
• Develop and maintain Tcl-based scripting and automation to enhance layout productivity within Innovus and related Cadence tools
• Evaluate and benchmark Cadence Innovus vs. Synopsys Fusion Compiler flows; provide data-driven recommendations on tool and methodology selection
• Enable and support industry-standard static timing analysis (STA) tools for test chips and Foundry IPs (FIPs), and ensure continued support and enhancement
• Collaborate with central CAD, design teams, local CAD teams, and EDA vendors (Cadence, Synopsys) to define next-generation PnR methodologies
• Work closely with internal and external design customers to understand requirements and deliver robust, scalable automation solutions
• Respond to customer/client requests proactively, developing solutions leveraging formal expertise and engineering judgment
• Contribute to process node bring-up by validating and refining flows on Intel's latest technology nodes

Requirements & Tech Stack

• Cadence Innovus Implementation System
• Synopsys Fusion Compiler (strong added advantage)
• Tcl-based scripting and automation
• RTL-to-GDS (R2G) flows
• PnR (Place and Route)
• Physical Design
• APR (Automatic Place and Route)
• CTS (Clock Tree Synthesis)
• Static Timing Analysis (STA) tools (e.g., Cadence Tempus)
• DRC (Design Rule Check)
• LVS (Layout vs. Schematic)
• MMMC (Multi-Mode Multi-Corner) analysis

Qualifications

• Master's degree in M.Tech or MS in Microelectronics, Electronics Engineering, or an equivalent qualification from a reputed institute, with relevant industry experience in physical design and APR flow development.

Technical Qualifications

• Physical Design and APR Expertise
• Proven hands-on experience in block-level design closure using Cadence Innovus as the primary APR tool for end-to-end RTL-to-GDS flows.
• Strong working knowledge of all key physical design stages including Floorplanning, Power Planning, Placement, Clock Tree Synthesis, and Routing.
• Well-versed with multiple optimization techniques available in Cadence Innovus for achieving design closure, including timing, area, power, and congestion optimizations.
• Ability to guide and mentor the team in resolving complex implementation challenges and providing structured solutions.
• Timing and Constraints
• Strong understanding of digital timing concepts including setup, hold, clock domain crossing (CDC), and multi-mode multi-corner (MMMC) analysis.
• Ability to analyze and validate design constraints SDC and understand their impact on timing closure.
• Experience with industry-standard STA tools such as Cadence Tempus or equivalent for timing sign-off.
• Layout Closure and Sign-off
• Demonstrated experience in achieving full layout closure for blocks, ensuring compliance with DRC, LVS, Density requirements, and Antenna violation fixes.
• Familiarity with physical verification tools and sign-off flows as per process technology specifications.
• Top-Level Integration
• Good understanding of top-level integration challenges and ability to ensure block-level deliverables meet project-level requirements for both timing and layout closures.
• Experience in managing block-to-top handoffs and resolving integration-level issues effectively.
• Domain Knowledge
• Strong foundation in VLSI design, digital electronics, and semiconductor device fundamentals.
• Good understanding of digital design timing closure principles and methodologies.
• Knowledge of semiconductor fabrication and process technology will be a distinct added advantage.
• Familiarity with Intel process technology or advanced node design environments is a plus.

Soft Skills and Behavioral Competencies

• Strong analytical and problem-solving skills with a structured approach to debugging complex physical design issues.
• Proactive and transparent communication style with the ability to articulate technical challenges and solutions clearly to stakeholders.
• Collaborative mindset with demonstrated ability to work effectively in a diverse, cross-functional, and geographically distributed team environment.
• Ability to work across multiple domains including design, CAD, and EDA vendor teams.

Leadership and Experience

• Leadership experience in driving block-level closure and physical design sign-off for tape-out is strongly preferred.
• Demonstrated track record of silicon success having contributed to or led designs that have been successfully taped out and validated in silicon is highly desirable.

Job Type: Experienced Hire

Shift: Shift 1 (India)

Primary Location: India, Bangalore

Additional Locations: N/A

Work Model: This role will require an on-site presence.