Manufacturing Engineer I

Raytheon

Andover, MA0–2 yrs3d agovia LinkedIn

About the Role

This position is for a Manufacturing Engineer I on 3rd Shift and includes a 12% shift differential. The role is Onsite in Andover, MA.

Key Responsibilities

  • Provide Operations Engineering support to the Circuit Card Assembly Factory.
  • Support the operation of SMT Process lines, including automated and programmable equipment, for multiple products.
  • Focus on process improvement, cycle time reduction, defect prevention, and operator support.
  • Participate in process improvement initiatives, establishment of process baseline metrics, SPC implementation, defect prevention, and process data analysis.
  • Create and oversee projects using risk management techniques.
  • Translate engineering design requirements into formal manufacturing process documentation.
  • Computer and machine programming for manufacturing automation.
  • Dispositioning of discrepant hardware.
  • Lead root cause and corrective action investigations.
  • Participate in process improvement and cost reduction initiatives using Lean Manufacturing methodology.
  • Manufacturing process development and support.
  • Conduct safety / ergonomic assessments.
  • Interact with senior personnel on technical matters, often requiring coordination between organizations and/or suppliers.
  • Tool/fixture development to drive ergonomics and reductions in cost and/or defect.

Requirements & Tech Stack

  • U.S. citizenship is required.
  • An active and transferable U.S. government issued security clearance is required prior to the start date.
  • The ability to obtain and maintain an interim U.S. government issued security clearance is required prior to the start date.
  • Security Clearance Type: DoD Clearance: Confidential.
  • Experience with automated equipment and programming.

Qualifications

  • Typically requires a Bachelor's degree in Science, Technology, Engineering or Math (STEM).
  • 0-2 years of prior relevant experience.
  • Knowledge and experience with ANSI J-STD-001 Class 3 & IPC-CC-830.
  • Experience in applying Lean Manufacturing principals.
  • Experience with supporting circuit card assembly production floor (process and/or quality focus).
  • Experience with Reflow Ovens.
  • Experience with X-Ray Inspection Equipment and touch-up operations.
  • Knowledge and ability to apply Six Sigma principles and techniques.
  • Innovative mindset that drives continuous improvement and keeps pace with advances in technology.
  • Demonstrated hands-on mechanical aptitude with the ability to work across disciplines.
  • Proficiency with CAD solid modeling tools.
  • An active DoD security clearance (confidential) is preferred.

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