Snr Process Engineer

About the Role

As a Senior Process Engineer at ASM, you will work with semiconductor processing and analytical equipment to research, develop, and optimize processes focused on oxidation, annealing, curing, Atomic Layer Deposition (ALD, PEALD), Epitaxy, or PECVD for logic, memory, analog, power, and MEMS applications. You will design and conduct complex experiments, measurements, and perform the interpretation of complex experimental output. Delivering creative and inventive solutions, technical publications, and generation of Intellectual Property (IP) are essential functions of this position.

Note: This role is intended for candidates graduating in Fall 2026 or who have graduated within the past two years and have 0–2 years of professional work experience.

Key Responsibilities

• Works with semiconductor processing equipment to research, develop, and optimize unit processes focused on the deposition of metal and dielectric films via ALD, PEALD, Epitaxy, and/or PECVD.
• Brings innovative ideas and stays abreast of state-of-the-art processing applications in the semiconductor industry.
• Provides process consulting and accountability, including technical papers on advanced process applications and Intellectual Property creation.
• Participates in and drives technical problem-solving sessions using the scientific method and industry tools, such as Ishikawa diagrams.
• Designs and conducts experiments, measures, and interprets experimental output using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Troubleshoots equipment problems and is actively engaged in problem-solving via "hands-on" modalities.
• Works with customers and central marketing to understand and define requirements for successful execution and documentation of customer demonstrations.
• Develops methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
• Ensures successful product transfer to customers by performing demonstrations, training field service personnel, traveling to support remote sites (up to 10% travel), and drafting documentation regarding process development, tool operation, and maintenance.
• Produces technical papers on process, equipment, and device integration improvement strategies and presents to professional audiences.
• May be assigned supervisory duties over supporting process engineering technicians and aides, including input into performance evaluations, discipline, and discharge.

Requirements & Tech Stack

• Creative problem solver with experience in developing new films for emerging applications and experience in chemistry/materials characterization.
• Experience with Cure, oxidation, ALD, CVD, Epitaxy, PECVD, and/or other thin film deposition techniques.
• Experience with materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, and ellipsometry.
• Knowledge of electrical characterization techniques for CMOS devices.
• Application of dielectric and/or metal films for logic and memory structures.
• Training in CFD (computational fluid dynamics), either theoretical or practical, is preferred.
• Knowledge of electrical characterization techniques for CMOS devices is preferred.

Qualifications

• Candidates graduating in Fall 2026 or who have graduated within the past two years.
• Master’s or PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• 0-7+ years of combined education, research, and work experience.
• 0–2 years of professional work experience.
• Ability to independently manage complex process development projects, including personnel, project schedules, experimental thrusts, hardware procurement, and budgetary oversight.
• Ability to act as a process consultant to internal and external customers.
• Authority on the interplay between hardware design (e.g., chemical reactor design) and operation, and process outputs.
• Understanding of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows.
• Demonstrated ability to develop and completely characterize deposition processes using first principles and experimental design techniques (e.g., DOE, RSM).
• Experience with the theory, practice, and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman, and ellipsometry.
• Excellent verbal and written communication skills, with the ability to clearly communicate advanced technical constructs in a direct and concise manner.