Process Integration Development Engineer

Intel

Hillsboro, ORFresher15m agovia LinkedInH-1B sponsor · 8 entry-level filings

This job at a glance

Who can apply
New grads and up to 1 year · Master's degree
Must know
Product management
Nice to have
Data analysisStatisticsPythonMATLAB
Work
On-site in Hillsboro
Pay
Not stated by the employer.
Skill demand
Statistics21%Python15%Data analysis11%Product management4%of 99 similar entry-level jobs posted in the US this week
Listed
Oct 28, 2026 · still open

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About the Role

Intel's Logic Technology Development (LTD) is seeking a Process Integration Development Engineer specializing in Defect Metrology. This role is central to developing new silicon process technologies, enabling the transition from research to high-volume manufacturing while maintaining high-quality standards. As part of the Manufacturing Integration Engineering (MIE) organization, you will drive yields on advanced processes by reducing defects to best-in-class targets.

Key Responsibilities

  • Identify all defects impacting yield and performance in advanced silicon process technologies.
  • Characterize processes using cutting-edge metrology tools.
  • Investigate root cause owners and develop defect reduction roadmaps to meet program milestone commitments.
  • Collaborate with process modules and integration teams to drive roadmaps by developing and qualifying process fixes through Model-Based Problem Solving (MBPS).
  • Respond to defect baseline shifts to isolate root causes and implement preventative actions using 8D methodology.
  • Own a segment of the process to ensure adequate metrology is in place to detect and respond to all yield-limiting defects before end-of-line sort.
  • Investigate and respond to exclusionary baseline shifts to restore segment defect health to capable, demonstrated baselines.
  • Develop new recipes and RFCs as part of New Product Introduction (NPI).
  • Provide navigation and leadership to meet Intel's yield objectives using state-of-the-art metrology tools and test vehicles (QTM, Short Loop, etc.).
  • Organize and present defect summaries to F25, LTD, and MDCE engineering teams.
  • Partner with Intel Integration, Yield, and failure analysis labs to provide root causes for all defect issues.
  • Hold the team and collaborators accountable for quality through Integrated Module Team (IMT) and Focus Team (FT) forums.
  • Work collaboratively as part of the overall LTD Defect metrology group.
  • Role-model and establish a team culture of trust, collaboration, safety, accountability, and sustaining excellence.
  • Build strong relationships with other LTD teams based on mutual trust and respect.

Requirements & Tech Stack

  • Strong data analysis and problem debug skills.
  • Team player with flexibility and adaptability to changing business needs.
  • Strong ownership mindset and driving closure.
  • Excellent communication and navigation skills to larger audiences.
  • Understanding and adherence to Intel cultural values.
  • Experience obtained through a combination of prior education, classes, projects, research, and relevant previous job and internship experience.

Qualifications

Minimum Qualifications

  • Master's degree in Materials Science and Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Nuclear Engineering, Optics, Chemistry, or Computer Science.
  • Hands-on experimental research experience: designing and conducting experiments, operating laboratory equipment (characterization, fabrication, or synthesis), and analyzing statistical data.

Preferred Qualifications

  • Demonstrated academic research, coursework, laboratory, or internship experience with one or more of the following:
  • Materials characterization (SEM, TEM, AFM, etc.), materials fabrication, synthesis, metrology, statistical or data analysis (MATLAB, Excel, JMP, Python, etc.).
  • Semiconductor processing fundamentals (lithography, wet and/or dry etch, chemical mechanical polishing, thin films), semiconductor and/or transistor device physics, and Design of Experiments (DOE).
  • Defect metrology, defect inspection/improvement, yield analysis, or process integration.
  • Demonstrated application of Statistical Process Control (SPC) or Design of Experiments (DOE) principles.
  • Complex problem-solving methodologies: root cause analysis, Model-Based Problem Solving (MBPS), 5 Why, Fishbone diagrams, or 8D frameworks.
  • Understanding of semiconductor physics or semiconductor processing cleanroom unit operations.
  • Understanding of defect metrology tools such as brightfield, darkfield, or voltage contrast (VC).

H-1B sponsor

Intel filed 8 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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