Intern

About the Role

As an ID1 High Volume Manufacturing Process Engineer Intern at Micron's Boise site, you will contribute to process optimization, yield improvement, and cost reduction initiatives within a historic $15 billion semiconductor manufacturing investment. This role involves collaboration with equipment teams, operations leaders, and multi-functional teams to optimize wafer output and achieve critical area metrics.

Key Responsibilities

• Complete required safety training and adhere to safety policies and laws.
• Ensure proper tool documentation and update reaction mechanisms as needed.
• Supervise and resolve issues impacting yield, excursions, defects, or output loss.
• Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability.
• Analyze data using engineering knowledge and visualization tools to make critical process decisions.
• Perform project work to optimize wafer processing and increase wafer outs.
• Update or create procedures to align with area and global practices.

Requirements & Tech Stack

• Current student in an engineering or related degree program; graduation date not before September 2027.
• Understanding of SPC and Design of Experiments.
• Proficiency in one or more scripting/programming tools (Python, Java) and visualization tools (Tableau, Matlab, Microsoft Suite).
• Ability to commit to 40 hours/week during Summer 2026 and 20 hours/week part-time during Fall 2026/Spring 2027.

Qualifications

• Excellent verbal and written communication skills.
• Experience with data collection, warehousing systems, and data cleansing.
• Hands-on experience in data analytics and database querying.
• Intermediate understanding of semiconductor Fab processes and equipment.
• Strong time management, organization, and prioritization skills.