Internship

StructaLink Group

Massachusetts, United StatesFresher3d agovia LinkedIn

About the Role

  • This is a Spring Internship position focusing on product development and laboratory research.
  • You will partner with the Engineering team to develop, test, and validate embedded hardware and firmware solutions for advanced industrial and scientific instrumentation products.
  • Reporting to the Flow Solutions Engineering Manager.

Key Responsibilities

  • Supporting hardware design validation, board bring-up, and troubleshooting activities.
  • Assisting in the development and testing of embedded firmware for microcontroller-based systems.
  • Developing and executing test procedures to verify system functionality and performance.
  • Working with communication protocols such as SPI, I2C, UART, CAN, or Ethernet.
  • Assisting with debugging using oscilloscopes, logic analyzers, and other laboratory equipment.
  • Documenting designs, test results, and development activities.

Requirements & Tech Stack

  • Currently pursuing a Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field.
  • Junior standing preferred (typically completed core EE/CE coursework).
  • Basic understanding of embedded systems, microcontrollers, and digital electronics.
  • Experience programming in C/C++.
  • Familiarity with hardware debugging tools such as oscilloscopes, multimeters, and logic analyzers.
  • Strong analytical, problem-solving, and communication skills.

Preferred Qualifications

  • Experience with STM32, NXP, TI, Microchip, or similar embedded microcontroller platforms.
  • Experience with electronic schematics and PCB layout tools.
  • Exposure to version control systems.

Internship Details

  • Duration: 6 months (01/05/2027 to 06/30/2027)
  • Compensation: $23.00–$31.00 per hour.
  • Encouraged to apply: Students currently enrolled at a university in the USA pursuing majors in Electrical Engineering, Mechanical Engineering, Civil Engineering, Manufacturing Engineering, Materials Engineering, Packaging Engineering, Biomedical Engineering, Chemical Engineering, Safety, Supply Chain, Bioengineering, Industrial Engineering, Petroleum Engineering, Aerospace Engineering, Construction Management, or Industrial and Systems Engineering.
  • Applications from students studying outside the USA will not be considered.

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