Intern, Process Integration

About the Role

As an Advanced Package TD Process Integration Intern, you will support the development of sophisticated interconnect technologies. This internship offers hands-on experience in problem-solving, experimental design, line monitoring, and data analysis, contributing to yield improvement and process optimization.

Key Responsibilities

• Lead problem-solving activities using structured methodologies such as Kepner-Tregoe (KT).
• Define and implement Design of Experiments (DoE) for process development.
• Communicate findings across local and global teams and present results to partners.
• Support line monitoring through project management and yield improvement initiatives.
• Develop new line monitoring methods and define critical metrics.
• Conduct experimental work using Micron systems and document outcomes.
• Analyze experimental results and provide clear, actionable recommendations.
• Proficient in the use of AI tools, workflows and agents to maximize learning.

Requirements & Tech Stack

• Currently enrolled in an accredited university with expected graduation no earlier than Fall 2026.
• Excellent data extraction, analysis, and reporting skills (e.g., JMP, system analytics).
• Strong collaboration and communication skills across multi-functional teams.
• Ability to prioritize multiple complex tasks and adapt to changing responsibilities.
• Initiative and flexibility to take on added responsibilities.
• Tenacity to work under tight timelines and limited resources.

Qualifications

• Experience with semiconductor process integration or packaging technologies (Preferred).
• Familiarity with structured problem-solving and decision-making frameworks (Preferred).
• Exposure to experimental design and statistical analysis tools (Preferred).
• Interest in advanced packaging and interconnect development (Preferred).