Packaging Module Equipment Development Engineer

About the Role

Intel's Packaging Module Development team is seeking a Packaging Module Equipment Development Engineer for an onsite role in Chandler, Arizona. This role is at the forefront of advancing Intel's assembly and packaging technologies, developing innovative processes and refining equipment for next-generation packaging solutions.

Key Responsibilities

• Assembly Process & Equipment Development: Develop, optimize, and qualify packaging assembly processes and hardware configurations to meet quality, reliability, cost, yield, productivity, and manufacturability targets.
• Statistical Process Characterization: Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to define process and equipment specifications, documenting improvements through technical reports and white papers.
• Design-for-Manufacturability (DFM): Verify the manufacturability of physical package layouts and oversee the end-to-end lifecycle of manufactured package processes, procedures, and production flows.
• Supplier & Material Management: Establish material specifications for contract assemblers and raw material vendors, partnering with supplier quality and procurement teams to enforce strict adherence to process and qualification standards.
• Early Risk & Quality Screening: Create new acceleration methods, analytical tools, and quality screens to identify and mitigate potential packaging quality and reliability risks early in the development cycle.
• Reliability Benchmarking: Set reliability requirements based on a fundamental understanding of failure mechanisms, influencing package design, material selection, and process development.
• Global Standardization & Consultation: Deliver standardization across product qualification methods and manufacturing quality systems, providing technical consultation to internal partner groups and responding to customer requests.

Requirements & Tech Stack

• Analytical Problem Solving: Strong troubleshooting mindset focused on innovating and continuously improving equipment and processes using structured experimental methods.
• Cross-Functional Collaboration: Clear, direct communication style to consult on packaging challenges and align priorities across technology development, procurement, and external vendor teams.
• Proactive Project Execution: Self-motivated and organized approach to driving complex, time-critical technical projects from concept through high-volume manufacturing.
• Adaptability & Ownership: Thrives in a fast-paced, hands-on onsite lab and factory environment, taking full ownership of technical risk mitigation and product milestones.

Qualifications

This is an entry-level position and will be compensated accordingly.

Minimum Qualifications

• A Bachelor's, Master's in Engineering, Physics, Chemistry, or a related STEM discipline.

Preferred Qualifications

• 6+ months of:
• Hands-on semiconductor experience or academic research supporting or developing manufacturing equipment.
• Experience working with dispense, mold, and/or cure packaging equipment technologies.
• Experience applying Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
• Experience with semiconductor fabrication processes, equipment sustaining, change control management, or quality data systems.
• Experience managing and delivering results for complex, time-critical technical projects.

Work Model

• This role will require an on-site presence in Phoenix, Arizona.