Hardware Engineering Internship

Job Title: Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

About Qualcomm

Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity.

Role Overview

As a Qualcomm Hardware Engineering Intern, you’ll have the opportunity to push the boundaries of what exists and help establish new standards for tomorrow. You will leverage your electrical and/or computer engineering degree to work on one of Qualcomm's multi-disciplinary teams.

This Internship Supports Multiple Technical Tracks, Including:

• GPU Engineering
• CPU Engineering
• Digital Design / DV
• SoC Systems Engineering

Key Responsibilities

• Engineering design and development in MSM SOC and chipset architecture
• ASIC implementation of image processing camera IP
• GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models)
• Graphics power analysis & optimization (Vulkan)
• Validation of CPU and SOC-level micro-architecture concepts
• Development of test and coverage plans, verification methodology, and scalable environments
• Execution of verification plans including regression, debug, and bring-up
• RTL development for modem physical and MAC layer processing
• Verification component development using SystemVerilog and UVM
• Modeling cellular modem datapaths for bit-exact correctness
• System-level performance modeling and simulation
• Power and thermal management strategies
• Post-silicon validation and characterization
• Embedded software design, driver development for Linux/Windows
• Understanding of power/performance tradeoffs and system-level architecture

Requirements & Tech Stack

• Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field
• Must be available for 11–14 weeks during Summer 2027 (May–September)
• Expected graduation date of November 2027 or later
• 1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog
• Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G
• Familiarity with simulators, coverage tools, waveform viewers
• Knowledge of digital design, DSP, wireless communication, LTE, 5G, Wi-Fi
• Exposure to machine learning concepts as applied to digital signal processing or modem architecture is a plus
• Concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.)
• OS principles and HW/SW interaction
• Experience supporting or optimizing machine learning workloads on embedded systems or accelerators

Qualifications

• Candidates actively pursuing a degree with an anticipated graduation between November 2027 and June 2028
• Currently enrolled in a Master’s or PhD degree program in computer engineering, electrical engineering, or a related field
• Programming experience in C, Perl, Verilog, SystemVerilog, C++, Python
• Programming experience in C, C++, Python
• Programming experience in C, Python, Perl, Verilog, SystemVerilog, C++, Matlab
• Programming experience in C/C++, Python; scripting and profiling tools

Qualcomm’s Internship Program

• Paired with a mentor with visibility to your project and team.
• Receive support from your manager.
• Access to the entire Qualcomm employee community.
• Professional development workshops.
• Social events.
• Cross-functional speaker sessions.
• Executive speaker series.
• Competitive hourly pay.
• Accrued vacation time.
• Relocation coverage.
• Furnished housing accommodations for the duration of your internship.

Internship opportunities may be available in the following locations, depending on team and project needs: Austin, Boulder, Boxborough, Bridgewater, Chandler, Irvine, New York City, Louisville, Raleigh, San Diego, Santa Clara, and Seattle.