Domain Manufacturing Systems Engineering Intern
Siemens Digital Industries Software
About the Role
Siemens Industry Software Inc. Strategic Student Program (SSP) is recruiting students for our {1st or 2nd semester of Senior year, or graduate level} program. This internship offers the opportunity to apply education to solve real-world problems and turn theory into practice.
About The Team
The Cross Product Solution Management (CPSM) team researches and develops innovative solutions demonstrating how modern engineering disciplines work together across Product Lifecycle Management (PLM), robotics, mechatronics, semiconductor manufacturing, electronics, AI, and software engineering. This internship offers the opportunity to contribute to a "silicon-to-rack" engineering initiative that showcases the integration of EDA, PLM, and AI-enabled workflows across the entire product development lifecycle.
What You'll Do
As an intern, you will work with senior engineers and technical specialists to:
- Research and evaluate emerging semiconductor engineering technologies (3D IC) and workflows
- Develop software prototypes, automation tools, and proof-of-concept solutions
- Explore semiconductor, PCB, and system-level design, validation, and implementation concepts
- Document technical findings through white papers, tutorials, and technical guides
- Investigate AI-assisted engineering and documentation workflows
- Learn and utilize industry-leading EDA and PLM tools
- Help define and demonstrate an end-to-end engineering digital thread from silicon design through system deployment
Areas of Exposure
Depending on project assignments, interns may gain experience in:
- Semiconductor and IC design and CAE methodologies
- 3D-IC and advanced packaging concepts
- Mechanical design integration
- Product Lifecycle Management (PLM)
- Technical documentation and workflow development
- Packaging and manufacturing concepts
Requirements & Tech Stack
- Pursuing a Bachelor's, Masters, or Ph.D. degree in Mechanical Engineering, Electrical or Electronics Engineering, or related STEM field
- Strong analytical and problem-solving skills
- Excellent verbal and written communication skills
- Ability to learn quickly and work independently
- Self-motivated, curious, and adaptable
- Familiarity with Linux or scripting environments
- Previous internship, co-op, or project experience a plus
Qualifications
- Currently enrolled as a university {Senior, Master’s or PhD candidate} student
- Minimum 3.0 GPA
- Authorized to work in the United States without the need for current or future sponsorship by the company
- Graduating 2028, or later
- Semiconductor packaging design and implementation research emphasis or exposure
- Interest in CAE, EDA, PLM, automation, or AI technologies