Fab Module Engineer

About the Role

As a Module Engineer, you will play a pivotal role in the high-volume manufacturing of cutting-edge integrated circuits. You will own critical equipment and processes, conducting tests and optimizations to ensure precision, safety, and production efficiency. Your day-to-day responsibilities will directly contribute to delivering high-quality products that drive Intel's leadership in semiconductor innovation.

Business Group

You will be part of Intel Corporation's Wafer Packaging Manufacturing (WPM) C4 OR group, which focuses on advancing manufacturing technologies to enable rapid device miniaturization and mass production of integrated circuits. The team collaborates globally to optimize processes, enhance equipment performance, and support Intel's broader vision of delivering world-class silicon solutions.

Key Responsibilities

• Own and maintain high-volume manufacturing equipment and processes to ensure optimal performance, precision, and safety.
• Conduct tests, measurements, and analyses to monitor critical dimensions and defectivity within the production line.
• Recommend and implement modifications to improve manufacturing techniques, production efficiencies, and overall output.
• Lead efforts to enhance safety, quality, cost indicators, and productivity across equipment and processes.
• Drive continuous improvement initiatives for equipment and process key performance indicators, collaborating with suppliers as needed.
• Manage the installation, conversion, and qualification of manufacturing tools during factory ramps, ensuring safe and timely execution.
• Develop and optimize excursion prevention systems to safeguard equipment and processes.
• Detect and address discrepant material or activities to maintain process integrity and reliability.
• Participate in technology transfer activities, including training and auditing installations at other sites to ensure consistent manufacturing processes globally.

Ideal Candidate Behavioral Traits

• Strong problem-solving and analytical skills with the ability to handle complex technical challenges.
• Effective communication and collaboration skills to work across teams and with global counterparts.

Minimum Qualifications

• Bachelor's degree in Engineering STEM related field (e.g., Electrical Engineering, Chemistry, Chemical Engineering, Mechanical Engineering, Material Science, Physics, Robotics, Molecular and Nanomaterials, Nanoengineering) with 6+ months of experience in equipment maintenance and/or repair processes within a manufacturing environment.
• This position is not eligible for Intel immigration sponsorship.

Preferred Qualifications

• Master’s degree in engineering STEM related field (e.g., Electrical Engineering, Chemistry, Chemical Engineering, Mechanical Engineering, Material Science, Physics, Robotics, Molecular and Nanomaterials, Nanoengineering).
• Demonstrated commitment to safety and quality in manufacturing operations.
• Understanding of process control techniques, defect analysis, and manufacturing efficiency optimization.

Location

• Primary Location: US, Oregon, Hillsboro
• Work Model: On-site