Intern, DRAM Process Integration

Micron Technology

Boise, IDFresher1h agovia LinkedInH-1B sponsor · 48 entry-level filings

This job at a glance

Who can apply
New grads and up to 1 year
Must know
Circuit design
Nice to have
StatisticsLLMsMachine learning
Work
On-site in Boise · internship
Pay
Not stated by the employer.
Skill demand
Statistics32%Circuit design19%Machine learning9%of 99 similar entry-level jobs posted in the US this week
Listed
Nov 6, 2026 · still open

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About the Role

The Process Integration team within Technology Development drives the development of future DRAM architectures by coordinating device, materials, and process innovations across multiple engineering fields. Team members work in a highly collaborative R&D environment to solve complex technical challenges and accelerate technology scaling.

About the Role: Intern - DRAM Process Integration

As a Process Integration Engineer Intern, you will contribute to the development of next-generation DRAM memory technologies through multi-functional collaboration involving process integration, device engineering, materials development, and process architecture. This role requires strong technical expertise, analytical problem-solving skills, and the ability to coordinate activities across multiple engineering organizations to achieve technology achievements and product objectives.

Key Responsibilities

  • Define technology achievements, design rules, structural requirements, and electrical specifications for next-generation DRAM technologies while supporting achievement of program targets and timelines.
  • Collaborate with process development, simulation, process architecture, circuit design, and quality teams to ensure alignment with product and technology requirements.
  • Develop and maintain documentation related to process integration plans, technical risks, issue resolution, and characterization strategies.
  • Evaluate alternative device architectures, process enablers, and scaling approaches to support future technology development.
  • Leverage approved Artificial Intelligence (AI) and AI-Assisted tools to enhance technical analysis, data interpretation, productivity, and engineering decision-making.

Minimum Qualifications

  • Currently pursuing a Master of Science degree in Electrical Engineering, Microelectronics, or a related technical field, with an expected graduation date of September 2027 or later.
  • Demonstrated knowledge of semiconductor process integration, device physics, and technology scaling principles.
  • Experience using Design of Experiments (DOE), statistical analysis, and data-driven problem-solving methodologies.
  • Proven ability to identify and resolve complex technical challenges in multi-functional engineering environments.
  • Strong written and verbal communication skills with the ability to present technical information clearly and effectively.

Preferred Qualifications

  • Currently pursuing or enrolled in a PhD program in Electrical Engineering, Microelectronics, or a related technical field.
  • Experience providing technical leadership or coordinating engineering activities in a research and development environment.
  • Demonstrated ability to develop innovative solutions and adapt effectively within rapidly evolving technology programs.
  • Proficiency with Artificial Intelligence (AI), Generative AI, or AI-Enabled tools for technical research, engineering analysis, or productivity enhancement.
  • Experience applying statistical modeling, advanced analytics, or machine learning techniques to semiconductor process development challenges.

H-1B sponsor

Micron Technology filed 48 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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