Intern, HIG HBM DTPCO
Micron Technology
This job at a glance
- Who can apply
- New grads and up to 1 year · Bachelor's degree
- Must know
- ExcelData visualization
- Nice to have
- Data analysisLLMsPythonSQL
- Work
- On-site in Richardson · internship
- Pay
- Not stated by the employer.
- Skill demand
- Excel44%Data analysis25%Data visualization8%LLMs4%of 99 similar entry-level jobs posted in the US this week
- Listed
- Nov 10, 2026 · still open
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About the Role
Within the HBM organization, highly collaborative engineering teams advance next-generation High Bandwidth Memory (HBM) solutions through device characterization, data analysis, modeling, and root-cause investigation. This role partners across Design Technology Co-Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development to drive product innovation and quality. In this internship, you will gain hands-on experience analyzing semiconductor product and manufacturing data to understand device performance and chip-package interactions. You will work alongside engineers to execute silicon learning activities, investigate technical issues, and develop data-driven solutions that improve engineering workflows. You will also have opportunities to apply automation, AI, Generative AI, and Agentic AI to engineering analysis and problem-solving.
Key Responsibilities
- Analyze probe, parametric, characterization, electrical, process, and manufacturing data to assess device health and identify trends, correlations, and potential root causes.
- Support engineering experiments, test vehicles, characterization activities, and silicon learning through data collection, analysis, documentation, and tracking.
- Perform cross-functional data correlation to evaluate interactions among semiconductor design, process technology, assembly/package, and electrical performance.
- Develop and improve automated data-analysis, visualization, and correlation workflows using Python, JMP/JSL, SQL, or similar tools.
- Apply AI, Generative AI, and Agentic AI to improve engineering workflows, data analysis, test development, and problem-solving efficiency.
Requirements & Tech Stack
- Currently enrolled in a Bachelor's degree program in Electrical Engineering, Computer Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Applied Physics, Computer Science, Data Science, or a related technical field.
- Expected to have completed sophomore year before the internship start date.
- Demonstrated foundational engineering knowledge through college coursework, laboratory experience, or at least one technical project.
- Experience using at least one programming or data-analysis tool such as Python, MATLAB, Excel, JMP, SQL, or a similar platform.
- Experience using data visualization, plots, statistics, or other analytical methods to identify trends, relationships, or correlations in technical data.
Preferred Qualifications
- Coursework, laboratory experience, or technical project experience related to semiconductor devices, electronics, semiconductor manufacturing, electrical test, packaging, reliability, or product engineering.
- Experience using Python, JMP/JSL, SQL, MATLAB, or similar tools to automate data analysis, visualization, or engineering workflows.
- Experience applying statistical methods, data correlation, or root-cause analysis to an engineering or technical problem.
- Experience Using AI, Generative AI, or Agentic AI in coursework, technical projects, data analysis, automation, or engineering problem-solving.
- Demonstrated ability to communicate technical findings and collaborate effectively through laboratory assignments, team projects, research, internships, or other technical experiences.