Intern, System Engineer, HBM

About the Role

As a High Bandwidth Memory (HBM) Product & System Engineering Intern, you will contribute to the validation and optimization of Micron’s HBM products. You’ll work alongside experienced engineers to develop innovative solutions for testing and integrating HBM into customer platforms, helping advance generative AI and high-performance computing.

Key Responsibilities

• Develop and improve software and hardware to validate HBM in various systems.
• Configure, maintain, and characterize HBM-based systems in a lab environment.
• Assist in debugging complex technical challenges across hardware and software.
• Communicate results and insights to teammates and leadership.
• Learn and apply knowledge of HBM, DRAM, and memory systems.

Requirements & Tech Stack

• Enrolled in a Bachelor’s or Master’s program or equivalent experience in Electrical or Computer Engineering.
• Graduation date must be after September 2027.
• Strong understanding of computer architecture, memory systems, and memory technologies.
• Proficiency in Python, C/C++, and scripting for debugging and testing.
• Excellent problem-solving and analytical skills.
• Enthusiastic teammate with strong communication skills and a proactive approach.

Preferred Qualifications

• Validate hardware, firmware, and software products through testing, debugging, and cross-functional integration.
• Use Linux environments and RTL modeling techniques with Verilog/SystemVerilog for design validation and development.
• Program, debug, and troubleshoot FPGAs and microcontrollers in lab and prototyping environments.
• Apply knowledge of memory interfaces and protocols including LPDDR, DDR, HBM, GDDR, CXL, UCIe, and PCIe.
• Utilize lab equipment such as oscilloscopes and logic analyzers.