Module Equipment Development Engineer

Intel

Hillsboro, ORFresher3h agovia LinkedInH-1B sponsor · 8 entry-level filings

This job at a glance

Who can apply
New grads, no experience needed · Bachelor's degree or Master's degree
Must know
AuditingProduct managementStatisticsData analysisBusiness analysisPython
Nice to have
Troubleshooting
Work
On-site in Hillsboro
Pay
Not stated by the employer.
Skill demand
Statistics14%Data analysis12%Auditing10%Product management4%of 99 similar entry-level jobs posted in the US this week
Listed
Nov 6, 2026 · still open

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About the Role

As a Module Equipment Development Engineer, you will lead the development and optimization of advanced semiconductor manufacturing equipment and processes, enabling Intel to deliver high-performance devices. Your contributions will directly impact Intel's technological leadership in the semiconductor industry and advance the capabilities of future technologies.

Intel Foundry Technology Development is focused on advancing semiconductor process engineering and delivering world-class manufacturing solutions that power Intel's product innovation. Working within this group, you will collaborate with global teams to develop cutting-edge technologies that enable the design and production of leading-edge devices, helping Intel maintain its leadership in a competitive and fast-paced market.

Key Responsibilities

  • Develop Equipment capable of delivering on new process requirements in Dielectrics Thin Films.
  • Develop robust Equipment modules that can be transferred seamlessly to high volume manufacturing.
  • Collaborate with equipment and material suppliers to evaluate, qualify, and implement novel technologies into manufacturing processes.
  • Support technology transfer to high-volume manufacturing through training, audits, and maintaining process consistency across sites.
  • Design, execute, and analyze experiments to optimize advanced manufacturing processes, including material selection, equipment metrology, and parameter tuning.
  • Perform feasibility studies and pathfinding activities to support innovative device architectures and future technology roadmaps.
  • Utilize advanced data analysis methods, including Statistical Process Control (SPC) and Design of Experiments (DOE), to guide process improvements and enhance yield.
  • Partner with cross-functional teams to ensure seamless process integration and manufacturability.

Requirements & Tech Stack

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications

  • Bachelor's degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related STEM field, with 4+ years of industry experience in semiconductor processing

OR

  • Master's degree in relevant STEM fields with 3+ years of domain-specific experience

OR

  • PhD in Materials Science, Chemical Engineering, Physics, Chemistry, or related STEM field with 6+ months experience in semiconductor processing

Industry experience in semiconductor processing/domain-specific experience includes one of more of the following:

  • Proficiency in semiconductor processing techniques such as lithography, etching, thin film deposition, or planarization.
  • Expertise in process characterization methods and statistical analysis tools, such as JMP, MATLAB, or Python.
  • Familiarity with materials characterization techniques like SEM, TEM, XPS, or ellipsometry.

Preferred Qualifications

  • Hands-on experience working with equipment troubleshooting, maintenance, or development in collaboration with suppliers.
  • Experience at a Semiconductor manufacturing tool supplier.
  • Knowledge of manufacturing technologies including vacuum processes, ALD, or CVD.
  • Strong problem-solving skills with the ability to manage multiple tasks in a fast-paced environment.
  • Collaborative mindset with a proven track record of working across interdisciplinary teams to achieve shared goals.

H-1B sponsor

Intel filed 8 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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