Module Development Engineer, LTD Dry Etch

About the Role

Join Intel Foundry Technology Development to advance the next generation of patterning. You will partner with cross-functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long-term systems for sustained performance. This role requires regular onsite presence.

Key Responsibilities

• Drive technology development for future technology and high-volume manufacturing, providing process integration and equipment solutions, and performing feasibility studies.
• Own and drive development of next-generation patterning processes, including process architecture, optimization strategies, and qualification methodologies.
• Perform pathfinding activities for process and hardware development on existing and first-of-kind equipment, enabling manufacturing of innovative device architectures and developing roadmaps for future technologies.
• Provide technical leadership for cross-functional problem-solving to resolve complex process and defect issues, driving root cause, containment, and corrective actions.
• Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies).
• Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems).
• Develop strategies and infrastructure to resolve difficult problems and implement systems for future management (standard work, monitoring, dashboards/analytics, knowledge capture).
• Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment.
• Influence technical direction, mentor engineers, and communicate status/risks clearly to stakeholders.
• Recommend and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimize production output.
• Partner with key equipment and material suppliers to develop and implement enabling elements of the technology. Perform process technology feasibility studies through theoretical simulations and/or practical engineering methods.

Requirements & Tech Stack

• Strong collaboration and problem-solving skills for cross-disciplinary teams.
• Ability to communicate technical data and concepts to both technical and non-technical audiences.

Qualifications

Minimum Qualifications:

• PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with relevant industry or graduate school research experience.

Or

• Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 2 years of relevant industry or graduate school research experience.

Or

• Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of industry experience at a leading foundry or dry etch equipment supplier.
• Hands-on experience in dry etch semiconductor manufacturing, including ownership of process development and optimization.
• Experience with plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms.
• Experience delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability.
• Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB.

Preferred Qualifications:

• 4+ years of direct industry experience developing and deploying dry etch processes for advanced logic, foundry technologies or dry etch equipment suppliers.
• Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration.
• Experience in managing complex process challenges and providing solutions such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion.
• Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation.
• Expertise in APC development and variability reduction in a manufacturing environment.
• Expertise in etch driven defect reduction and metrology in a manufacturing environment.
• Proven ability to lead technical problem solving across projects, influencing peers and stakeholders.