Foundry Module Development Engineer, CMP

Intel

Hillsboro, ORFresher4h agovia LinkedInH-1B sponsor · 8 entry-level filings

This job at a glance

Who can apply
New grads, no experience needed · Bachelor's degree or Master's degree
Nice to have
StatisticsData analysis
Work
On-site in Hillsboro
Pay
Not stated by the employer.
Skill demand
Statistics19%Data analysis5%of 99 similar entry-level jobs posted in the US this week
Listed
Nov 11, 2026 · still open

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About the Role

Join Intel and help create the next generation of technologies that will shape the future. Engineers within Intel's Logic Technology Development (LTD) organization innovate leading-edge fabrication processes. The role of a Chemical Mechanical Planarization (CMP) Process Development Engineer in LTD encompasses developing and sustaining planarization techniques for a variety of materials and architectures.

Key Responsibilities

  • Designing, executing, and analyzing experiments necessary to meet engineering specifications for the process.
  • Participating in the development of intellectual property.
  • Developing equipment and components necessary to leverage understanding gained in research (in collaboration with suppliers), identifying shortcomings, and proposing and evaluating modifications to mitigate issues or enable new capabilities.
  • Overseeing unique CMP steps in a manufacturing line, integrating thousands of steps for the manufacture of complex microprocessors, while simultaneously transferring the technology to counterparts in manufacturing sites across the globe.

Requirements & Tech Stack

  • CMP techniques leverage physics, chemistry, materials science, and surface science concepts.
  • Diverse scientific backgrounds requiring strong collaboration and shared learning.

Qualifications

Minimum Qualifications

  • Bachelors degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related Scientific STEM field of study with 4+ years of Semiconductor Industry experience (semiconductor processing and semiconductor fabrication).
  • Masters degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related Scientific STEM field of study with 3+ years of Semiconductor Industry experience (semiconductor processing and semiconductor fabrication).
  • PhD degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related Scientific STEM field of study with 6+ months of Semiconductor Industry experience (semiconductor processing and semiconductor fabrication).

Preferred Qualifications

  • Experience developing, qualifying, or sustaining semiconductor manufacturing equipment in a high-volume production or technology development environment.
  • Demonstrated expertise in structured problem solving, experimental design, statistical data analysis, and hardware capability improvement.
  • Experience collaborating with cross-functional engineering teams and external suppliers to develop equipment solutions, drive technology transfers, and enable new process capabilities.
  • Rapid analysis of complex process issues and identification of a solution path.
  • Ability to be self-directing and show initiative.
  • Ability to take initiative and adapt to evolving priorities.
  • Ability to work effectively in a collaborative and fast-paced environment.
  • Strong communication skills, including the ability to summarize complex data sets for technical and non-technical audiences.

H-1B sponsor

Intel filed 8 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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