Process Integ and Yield Eng PhD Intern Grade 029

Intel

Hillsboro, ORFresher23m agovia LinkedInH-1B sponsor · 8 entry-level filings

This job at a glance

Who can apply
New grads and up to 1 year
Must know
TroubleshootingData analysis
Nice to have
PythonC++CMATLAB
Work
On-site in Hillsboro · internship
Pay
$120.9K–$120.9K a year
Skill demand
Troubleshooting39%Data analysis27%Python13%C++2%of 99 similar entry-level jobs posted in the US this week
Listed
Nov 10, 2026 · still open

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About the Role

As a Process Integration and Yield Engineering PhD Intern, you will contribute to the development and optimization of advanced semiconductor manufacturing processes. In this hands-on role, you will analyze defect data, conduct experiments, and enhance process integration flows to support yield improvement initiatives. Collaborating with cross-functional engineering teams, you will tackle technical challenges, optimize metrology strategies, and help refine manufacturing processes in high-volume production environments. Your contributions will play a pivotal role in advancing Intel's cutting-edge semiconductor technologies.

Key Responsibilities

  • Contribute to the development and refinement of module processes and integration flows for semiconductor manufacturing.
  • Analyze defect data, conduct experiments, and assist with risk assessments to enhance yield improvement initiatives.
  • Collaborate with cross-functional engineering teams to troubleshoot process flow issues and optimize metrology strategies.
  • Apply advanced data analysis techniques to improve process performance and production efficiency.
  • Participate in continuous improvement efforts focused on enhancing manufacturing quality and scalability in high-volume environments.
  • Engage in hands-on learning through innovative projects that align with Intel's business goals and prepare you for future career opportunities.

Requirements & Tech Stack

Minimum Qualifications

  • Must be currently pursuing a PhD degree in Chemistry, Physics, Material Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Computer Science or related STEM Degree.
  • Proficiency in data analysis tools and methods.

Preferred Qualifications

  • Expertise in database structures, research methods, machine learning, analytics packages (i.e., JMP, MATLAB, Octave), scripting languages (i.e., Python, JSL, Perl, TCL), programming languages (i.e., SQL, C/C++), or application design and planning (Figma, Visio).
  • Hands-on experience with semiconductor fabrication, process integration, or yield engineering.
  • Knowledge of Statistical Process Control (SPC), Design of Experiments (DOE), or machine learning techniques.
  • Knowledge of semiconductor device physics and manufacturing fundamentals.
  • Experience with Transistor Device Structures and Device Physics.
  • Experience with Semiconductor materials, fabrication, and device physics.
  • Experience with Semiconductor Devices (transistor, diode, etc.).
  • Experience with microscopy or materials characterization techniques.
  • Experience working in cleanroom, laboratory, or advanced manufacturing environments.
  • Strong communication skills and ability to collaborate effectively across multidisciplinary teams.
  • Strong analytical, problem-solving, and data interpretation skills.
  • Demonstrated ability to partner with stakeholders to streamline business processes and build scalable solutions.

Work Model & Location

  • This role will require an on-site presence.
  • Primary Location: US, Oregon, Hillsboro.
  • Additional Locations: Provided on posting.

Compensation

  • Annual Salary Range for jobs which could be performed in the US: $120,898.00 - $120,902.00 USD.
  • Internship rates are based on degree, location, and job role.

H-1B sponsor

Intel filed 8 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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