Smart Infrastructure Electrical Products Engineering Leadership Development Program Internship

Siemens

Peachtree Corners, GAFresher25m agovia LinkedInH-1B sponsor · 3 entry-level filings

This job at a glance

Who can apply
New grads and up to 1 year · Bachelor's degree
Must know
Product managementProject managementNetworkingMicrosoft OfficePythonC
Work
On-site in Peachtree Corners · internship
Pay
Not stated by the employer.
Skill demand
Microsoft Office18%Project management13%Networking12%of 119 similar entry-level jobs posted in the US this week
Listed
Nov 8, 2026 · still open

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About the Role

This is a 12-week summer internship (May 17, 2027 – August 6, 2027) within the Smart Infrastructure Electrical Products division, designed to prepare interns for a potential full-time, two-year rotational development program upon graduation. The role is based in Peachtree Corners, GA, Roebuck, SC, Hingham, MA, and Grand Prairie, TX.

Key Responsibilities

  • Apply classroom knowledge to address real-world challenges and launch smart power distribution and power management systems and energy-efficient solutions.
  • Work on projects related to the development, innovation, and strategic growth of low voltage and control products for intelligent electrical power distribution and switching.
  • Engage in functions including product design, product management, feasibility analysis, manufacturing and quality assurance, project management, or applications engineering.
  • Participate in product trainings, fireside chats with guest speakers, skills workshops, mentorship, and networking activities.

Requirements & Tech Stack

  • Basic Qualifications:
  • Currently enrolled in a degree or certificate program who will continue studies following the assignment.
  • Undergraduate and graduate students pursuing a bachelor’s or master’s degree in: Computer Engineering, Computer Science, Electrical Engineering, or Mechanical Engineering.
  • Ability to work 40 hours per week (Monday – Friday) from May 17 to August 6.
  • Willing and able to relocate for the summer (relocation assistance provided for moves > 50 miles).
  • Willing to travel for business purposes.
  • Organized, self-motivated, dedicated to quality and excellence with acute attention to detail.
  • Effective communication and problem-solving skills.
  • Proficient in use of Microsoft Office Suite.
  • Legally authorized to work in the United States on a continual and permanent basis without company sponsorship.
  • Preferred Qualifications:
  • GPA: 3.0 or higher.
  • Skilled in any of the following: 3D CAD, additive manufacturing, circuit design, embedded systems, microcontrollers, testing, C, or Python.

H-1B sponsor

Siemens filed 3 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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