Product Design R&D Intern

About the Role

• This is a 12-14 week internship for Summer 2027, typically from May through August.
• The role is based in Colorado Springs, CO.
• You will work directly with an R&D engineer on FOUP (front-opening unified pod) and wafer microenvironment research for 300mm semiconductor manufacturing.
• The assignment requires availability for 40 hours a week, Monday to Friday (8 am - 5 pm).

Key Responsibilities

• Support FOUP and microenvironment purge research by planning and running lab experiments.
• Design components such as purge diffusers, sensor mounts, and test fixtures in CAD (SolidWorks).
• Build prototypes and test hardware using 3D printing, machined parts, and purchased components.
• Integrate sensors, wiring, and simple data acquisition and controls.
• Apply fluid mechanics fundamentals and analytical or simulation tools to evaluate new concepts and compare predictions against test data.
• Analyze test data, document methods and results in clear technical reports, and present findings and recommendations to the engineering team.
• Help improve the engineering team’s test capabilities including fixtures, testing devices, procedures, and safe lab practices.
• Deliver design models, test hardware, documented results, and technical recommendations that feed directly into active product development projects.

Requirements & Tech Stack

• Currently pursuing a bachelor’s degree in Mechanical Engineering or a related engineering field.
• Completed coursework in fluid mechanics and mechanical design.
• Experience with 3D CAD (SolidWorks preferred).
• Hands-on building experience through labs, a machine shop, 3D printing, or student design teams.
• Familiarity with basic electronics, sensors, or microcontrollers (e.g., Arduino, Raspberry Pi) is a plus.
• Familiarity with data analysis tools (Python, MATLAB, or Excel) is a plus.
• Curious, self-motivated, and comfortable working in a lab environment.
• Strong written and verbal communication skills.

Desired Major(s) & Graduation Year

• Majors: Mechanical Engineering (preferred), Electrical/Mechatronics Engineering, or Engineering Physics.
• Graduation Year: December 2027 – May 2029.

Eligibility

• Must be a currently enrolled student.
• Must be familiar with the university’s requirements to participate in an internship program.
• Entegris does not provide immigration-related sponsorship for this role. Do not apply if you will need Entegris immigration sponsorship (e.g., H1B, TN, STEM OPT, etc.) now or in the future.
• Physical requirement: Ability to carry a 20 lb. product.

Compensation

• $20-$30/hour range, with actual pay dependent on candidate's overall skills for the role.