Smart Infrastructure Electrical Products Engineering Leadership Development Program Internship

Siemens

Roebuck, SCFresher26m agovia LinkedInH-1B sponsor · 3 entry-level filings

This job at a glance

Who can apply
New grads and up to 1 year · Bachelor's degree or Master's degree
Must know
Product managementProject managementNetworkingMicrosoft OfficeCADCircuit design
Work
On-site in Roebuck · internship
Pay
Not stated by the employer.
Skill demand
Microsoft Office19%Project management13%Networking13%Product management1%of 120 similar entry-level jobs posted in the US this week
Listed
Nov 8, 2026 · still open

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About the Role

  • Siemens Smart Infrastructure Electrical Products Engineering Leadership Development Program Internship
  • 12-week summer internship (May 17, 2027 – August 6, 2027)
  • Prepares participants for a potential full-time, two-year rotational development program upon graduation.
  • Locations: Peachtree Corners, GA, Roebuck, SC, Hingham, MA, and Grand Prairie, TX.

Key Responsibilities

  • Apply classroom knowledge to address real-world challenges in launching smart power distribution and power management systems and energy-efficient solutions.
  • Work on projects related to the development, innovation, and strategic growth of low voltage and control products for intelligent electrical power distribution and switching.
  • Engage in a range of functions including:
  • Product design
  • Product management
  • Feasibility analysis
  • Manufacturing and quality assurance
  • Project management
  • Applications engineering
  • Participate in:
  • Product trainings
  • Fireside chats with guest speakers
  • Skills workshops
  • Mentorship
  • Networking activities

Basic Qualifications

  • Currently enrolled in a degree or certificate program who will continue studies following the assignment.
  • Undergraduate and graduate students pursuing a bachelor’s or master's degree in:
  • Computer Engineering
  • Computer Science
  • Electrical Engineering
  • Mechanical Engineering
  • Ability to work 40 hours per week (Monday – Friday) from May 17 to August 6.
  • Willing and able to relocate for the summer (relocation assistance provided if relocation is more than 50 miles from permanent address) and travel for business purposes.
  • Organized, self-motivated, dedicated to quality and excellence with acute attention to detail.
  • Effective communication and problem-solving skills.
  • Proficient in use of Microsoft Office Suite.
  • Legally authorized to work in the United States on a continual and permanent basis without company sponsorship.

Preferred Qualifications

  • GPA: 3.0 or higher.
  • Skilled in any of the following:
  • 3D CAD
  • Additive manufacturing
  • Circuit design
  • Embedded systems
  • Microcontrollers
  • Testing
  • C
  • Python

H-1B sponsor

Siemens filed 3 entry-level H-1B applications for new hires (Oct 2025 - Jun 2026, Department of Labor).

See their H-1B record →

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